Custom PIC Chip Development
- Passive and active photonic component design
- Full PIC design, layout, validation and tape-out
- PDK Development: SOI, SiN, TFLN, EOP
- Multi-project wafer (MPW) submission
Photonic Package Development
- RF substrate, Si interposer design
- Fiber-to-chip coupling
Photonic Consulting
- Photonic package feasibility study
- Optical interconnect prototyping
- Expertise in Photonic and RF testing equipment
- Expertise in high-speed photonic measurements
Design Tools
- Photonic: Ansys Lumerical, Tidy3d, Comsol, etc.
- Script based Open-source Tools: GDSFactory, SAX, Meep/MPB, etc
- RF: Ansys HFSS, Circuit, COMSOL multi-physics, open source and custom developed tools
- Mechanical, Opto-mechanical: Solidworks, Zemax Optical Studio